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MFM
METAL FILM MELF PRECISION RESISTOR

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Features
 • MELF configuration
 • Excellent overall stability
 • Tight tolerance down to +-0.1%
• Extremely low TCR down to +-10ppm/C

 Applications
 • Automotive
• Telecommunication
 • Medical Equipment

GENERAL SPECIFICATIONS

Model

Power
Rating
at 70C

Operating
Temp.
Range

Max.
Operating
Voltage

Max.
Overload
Voltage

Resistance Range[¥Ø]

TCR
(ppm/C)

+-0.1%

+-0.25%

+-0.5%

+-1%

MFM 0204

1/4W

-55 to
+155C

200V

400V

100-20K

10-20K

+-10

100-100K

10-100K

+-15

100-270K

10-330K

4.7-560K

4.7-1M

+-25

100-270K

1-330K

1-1M

1-10M

+-50

MFM 0207

1/2W
(1W)

-55 to
+155C

300V
(350V)

500V
(700V)

100-20K

10-20K

+-10

100-100K

10-100K

+-15

100-400K

10-400K
(4.7-1M)

10-560K
(4.7-1M)

10-560K
(4.7-560K)

+-25

100-400K

1-330K
(10-1M)

1-1M

1-5.1M
(1-2.2M)

+-50

CHARACTERISTICS                                                  Values in [ ] mean change in ohmic value after test

Temp. Coefficient of
Resistance

As Spec.

+20/-15/+20/+100/+20C

Short Time
Overload

¥ÄR+-0.5%

RCWV*2.5 or Max. overload voltage for 5 sec.

Endurance

¥ÄR+-2%

70+-2C, Max. working voltage for 1000hrs with
 1.5hrs ¡°ON¡± and 0.5hrs ¡°OFF¡±

Damp Heat
with Load

¥ÄR+-2%

                           40+-2C, 90-95% R.H. Max. working V
for1000hrs with 1.5hrs ¡±ON¡± and 0.5hrs ¡°OFF¡±

Dry
Heat

¥ÄR+-2%

At +125C for 1000hrs

Soldering
Ability

95% min. coverage

245+-5C for 3sec.

Resistance to
Soldering Heat

¥ÄR+-0.5%

260+-5C for 10sec.

*Reference Standard:  JIS-C 5201-1
*Storage Temperature: 25+-3C; Humidity < 80%RH

STRUCTURE

1

Alumina Substrate

2

Bottom Electrode(Ag-Pb)

3

Top Electrode(Ag)

4

Edge Electrode(NiCr)

5

Barrier Layer(Ni)

6

External Electrode(Sn)

DIMENSIONS

Packaging
 180mm 7¡±
0204 3000pcs.
0207 2000pcs

 Weight (/1Kpcs.)0204 18.7g
0207 80.9g

DERATING CURVE

ORDERING PROCEDURE EXAMPLE

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